Plus comments here indicate it's better suited to stencil use rather than manual placement, which is what I'm almost always doing. max) to ensure even distribution of any separated material. Mix the product lightly and thoroughly (1-2 mins. With the eC-reflow-mate, the reflow duration can be set in two ways: either by adjusting the points in the profile curve, or by enabling and setting the reflow hold time option. Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use. I do mostly one offs, and somewhat intermittently nowadays, so although a jar of GC10 might be more cost effective, I'd never be able to make use of more than a small fraction of it. NC258 is best used within 1 year when stored between -22° and +22° C (-8° and 72° F). I've thought about trying some GC10, but nobody seems to sell it in small quantities. 'Pb-Free' solder paste reflow: Nominal peak temperature is 250☌ ☑0☌ with time above the 217☌ to 221☌ melting point of 60s ☑5s, which should be verified at machine setup by inline thermocouple measurements oven profiling. I'd prefere the no-refrigeration types as I reckon they'll last me longer. Typical temperature Profile for Eutectic Sn-Pb Solder paste. And they do offer quite a few varieties of solder paste - both the types I mentioned above also seem to have "standard refrigeration" counterparts - so what mitght be said about one type might not hold true for the rest. There doesn't seem to be much mention of Chip Quick paste out there though. Test Results Test J-STD-004 or other requirements as stated Test Requirement Result Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough Corrosion IPC-TM-650: 2.6. Unfortunately CML Supply is out of stock, but I've found the Chip Quik stuff seems easy to get hold of. Recommended Profile Reflow profile for Sn42/Bi57.6/Ag0.4 solder assembly, designed as a starting point for process optimization. None of which was happening when the paste was fresh, so I'm putting it all down to age. When it does work, I end up with a lot of solder balls along the sides of passives that I need to clean up. SMT Board Assembly Process Recommendations. When heating it flattens out completely, and half the time doesn't appear to melt, instead turning into a dull grey sludge. I've been using a sryinge of Kester EP256, but my current tube is way past it's expiry date. Specifically, I'm looking at their TS391AX 63/37 paste and their TS391SNL SAC305 stuff, both no-clean, no-refrigeration types.
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